Samsung and SK Hynix to Unveil Record-Breaking $720 Billion Semiconductor Investment Plan
South Korea’s two semiconductor giants will unveil their long-term investment roadmaps at the presidential office on Monday, with sources indicating the combined figure could exceed 1,000 trillion won — roughly $720 billion.
President Lee Jae-myung is set to host a public briefing at the Blue House on June 29, where Samsung Electronics and SK Hynix will each present their group-level investment strategies. Samsung Chairman Lee Jae-yong and SK Group Chairman Choi Tae-won are both confirmed to attend.
The plans span semiconductor cluster developments across three provinces — Jeolla, Chungcheong, and Gyeongsang — and cover the next ten years, according to Yonhap News. Chief presidential spokesperson Kang Yoo-jung announced the event on Sunday, noting the briefing is part of a broader government effort to present three major national project roadmaps.
The 1,000 trillion won figure (roughly 4.4 trillion yuan at current exchange rates) would make it the largest coordinated semiconductor investment package ever announced by South Korean industry. Neither company has confirmed the exact figure, but multiple sources expect the number to be in that range.
The timing follows a June 24 announcement from the presidential office that final discussions on new semiconductor cluster locations were underway. Policy chief Kim Yong-beom said at the time that AI demand for chips was growing at “exponential and explosive rates,” forcing both companies to dramatically accelerate their existing cluster construction plans in Yongin.
Samsung and SK Hynix together control more than 70% of the global memory chip market. The investment push comes as both companies race to scale high-bandwidth memory (HBM) production for AI accelerators while also expanding general-purpose DRAM and advanced packaging capacity.
Monday’s briefing will include presentations from relevant government ministries on supporting policies before the two companies detail their investment blueprints.